Sputtering metallization line for ITO glass

Sputtering line for glass metallization with ITO deposition designed to produce conductive and transparent layers on glass substrates used in screens (LCD, PDP, OLED), touch panels, and other optoelectronic applications.

• Technology: vacuum magnetron sputtering with dual cathode system and medium frequency (MF) power supply, allowing controlled deposition of ITO and dielectric layers such as SiO2.
• Control and automation: integration of PLC systems and computers for dynamic visualization of parameters, alarms, data recording, and printing. Fully automated control of critical process stages.
• Online monitoring: possibility of connecting optical inspection systems to measure color and film thickness during the process, with automatic adjustment and parameter traceability.
• Expected results: conductive and optically uniform films with good thickness control and reproducibility, suitable for industrial-scale production.

B2B customer benefits:

• Greater batch consistency and reduced rejections due to automated control and online monitoring.
• Flexibility to deposit conductive (ITO) and dielectric (SiO2) layers on the same platform.
• Simple integration into existing production lines via PLC/PC control and optical inspection systems.
• Scalable for mass production of components for displays and optoelectronic devices.

Options and customization:

• Configuration of sputtering stations and MF sources according to production requirements.
• Integration of various optical measurement systems for color and thickness control.
• Possibility of additional automation for substrate handling and data traceability.

Typical applications:

• ITO deposition for LCD/OLED screens and touch panels.
• Transparent conductive films for optoelectronic devices and sensors.
• Functional coatings on glass for electronics and photovoltaic industries.

Note: Final specifications (performance, hourly performance, energy consumption, dimensions, and configuration options) depend on the chosen configuration and must be confirmed with the equipment's technical specifications.